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US Patent Issued to DCSTAR on Nov. 18 for "Mask" (New York Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,588, issued on Nov. 18, was assigned to DCSTAR INC (New York). "Mask" was invented by Ligui He (New York). The patent was filed on March 2... Read More


US Patent Issued to KAO on Nov. 18 for "Liquid-crystal composition" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,494, issued on Nov. 18, was assigned to KAO Corp. (Tokyo). "Liquid-crystal composition" was invented by Takanori Kotera (Wakayama, Japan) a... Read More


US Patent Issued to BEIJING BOE TECHNOLOGY DEVELOPMENT on Nov. 18 for "Video processing method and device, electronic apparatus, and readable storage medium" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,529, issued on Nov. 18, was assigned to BEIJING BOE TECHNOLOGY DEVELOPMENT Co. LTD. (Beijing). "Video processing method and device, electro... Read More


US Patent Issued to HENKEL on Nov. 18 for "Fabric softening composition comprising esterquat, cationic acrylic polymer, and germicidal cationic surfactant" (American, German Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,514, issued on Nov. 18, was assigned to HENKEL AG & Co. KGAA (Dusseldorf, Germany). "Fabric softening composition comprising esterquat, cat... Read More


US Patent Issued to NANYA TECHNOLOGY on Nov. 18 for "Semiconductor structure with anti-back-sputter layer" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,116, issued on Nov. 18, was assigned to NANYA TECHNOLOGY Corp. (New Taipei, Taiwan). "Semiconductor structure with anti-back-sputter layer"... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Nov. 18 for "Bump structure and method of manufacturing bump structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,210, issued on Nov. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bump structure and method of ma... Read More


US Patent Issued on Nov. 18 for "Flat foldable lectern and enclosed briefcase" (New York Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,471,685, issued on Nov. 18. "Flat foldable lectern and enclosed briefcase" was invented by Aron Fischer (Monsey, N.Y.). According to the abstr... Read More


US Patent Issued to HYUNDAI MOBIS on Nov. 18 for "Vehicle and method of controlling the same" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,819, issued on Nov. 18, was assigned to HYUNDAI MOBIS Co. LTD. (Seoul, South Korea). "Vehicle and method of controlling the same" was inven... Read More


US Patent Issued to Product Launch Advisors on Nov. 18 for "Smart controller for sequenced power delivery" (South Carolina Inventor)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,472, issued on Nov. 18, was assigned to Product Launch Advisors LLC (Rock Hill, S.C.). "Smart controller for sequenced power delivery" was ... Read More


US Patent Issued to TOYOBO on Nov. 18 for "Thermal adhesive laminated oriented film" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,464, issued on Nov. 18, was assigned to TOYOBO Co. LTD. (Osaka, Japan). "Thermal adhesive laminated oriented film" was invented by Yoshitak... Read More